1- Warning

• Only authorized user are allowed to operate the MAS400 mask aligner. The list of the authorized user is located next to the tool. To get authorized, contact the tool supervisor (see LAMP management). Operating the tool without qualification will result in the expulsion from the LAMP facility.
• UV Exposure: The UV light produced by the exposure lamp can cause erythema of the skin (similar to sunburn) and conjunctivitis. The lamp also produces large infrared output which can cause retinal burns resulting in blindness. Be sure that the light guards around the exposure area are not removed, and that the high pressure lamp and exposure path are enclosed. Avoid looking directly at the mask during exposure unless wearing UV and IR protective glasses.
• Lamp Exhaust: The high-pressure lamp produces ozone, which can result in pneumonia-like symptoms. The effects are cumulative. Be sure that the air flow from the HEPA units is not impeded to keep ozone from accumulating.
• High Power: The MAS400 mask aligner uses ignition voltages of 30kV and operating voltages of 180V, with currents of 5 to 30amps. Ensure that the power line is disconnected before any system maintenance.

Slide your UMCP ID to login

Power supply on.  Turn on the cooling fan.  Press start button for 1 second to ignite lamp, wait about 5 minutes for lamp to warm up.  Power will be about 45mw/cm².

Turn on air (Pressure not to exceed 40 psi).  Table will float in a few minutes.

Turn on system by pressing the white button near the monitor.  Load substrate and mask (low vacuum, and upper vacuum).

If using for first time for this substrate, make sure micrometer on lower right side is turned all the way in (CW).

Turn mask over, slide over substrate and press mask clamp riser (if button is not lit, then you must first lower fine vertical with joystick until riser button comes on).

After mask clamps, then raise lower chuck by turning lower right micrometer out (CCW).  Watch distance between substrate and mask carefully or you might break your sample, mask, even the machine.

Switch to single field reflectance and move objective lens to 5X.  Turn the focus light on.  Slowly increase voltage to maximum (about 7V 3A).  Focus on mask.

Move wafer rotation, wafer scan and mask scan to make alignment.

Move stage under the U. V. light.  Set exposing time.  Turn you head or wear protective goggles!  Tell the room that you are going to exposing!  Press U. V. expose.

Lamp intensity is about 45mw/cm². at 405 nm wavelength.

Move stage to center position).

Press mask clamp riser.  Remove mask and substrate.

Slowly decrease the voltage of focus light to minimum.

Turn off the system.

When you turn everything off, make sure you turn the power supply back on so the cooling fan will be on.

Slide your UMCP ID again to logout.